2012 China Conferences Announced
Call for Papers 2012 for the Technology Conferences
Download the full details (English and Chinese)
The SMTA China cordially invites you to participate in SMTA China Conferences located in Chengdu, Shanghai, Wuhan, and Shenzhen for 2012. These events will address the industry's most pressing issues in electronics manufacturing, business focus, advanced packaging, emerging technologies, and lead-free & reliability.
Topical coverage includes:
Assembly: Adhesives, Alternate Alloys, BGA/CSP Assembly, Cleaning, Conformal Coating and Potting, Connector Technology, Copper Erosion, DFX/Design for Six Sigma, Dispensing, Equipment Selection, Facility Layout, Flux and Solder, Halogen and Halogen-Free, Head-in-Pillow Defect, Land Pattern Design, Lead-Free Soldering (including case studies), Lead-Free Reliability, Lean Manufacturing, Low Volume / Prototype Assembly, Medical Electronics, Placement, Printing, Reflow Soldering, Rework and Repair of QFNs, RFID Assembly, Selective Soldering, Set Up Reduction, Solder Paste, Solder Voids, Supplier Engineering, Underfill and Corner Glue, Vapor Phase Reflow for High Reliability Assemblies, Wave Soldering, Yield Improvement.
Business: Capacity Modeling, Contract Manufacturing, Doing Business in Asia, Environmental Issues, Lean Manufacturing / Quality Initiatives, Operations Management, Remaining Competitive, RoHS/REACH Compliance, Supplier Management, Technology Roadmaps.
Emerging Technologies: 0201/01005 Components and Assembly, Advanced Packaging Concepts/Applications, Consumer Applications, Electronic Printing Technology, Embedded Technology / Actives and Assembly, Flexible Electronics, MEMS/RF, MEMS/MOEMS, Nanoelectronics, Reliability of Nanodevices, New Materials and Processes, Optoelectronics, Printed Electronics, Power or Thermal Management, Sensors and Manufacturing, Solar Technology, Solid State Lighting, System in a Package, Thermal Interface Materials, and Wireless Applications including Bluetooth and Wi-Fi.
Harsh Environment Applications: Alternate Energy, Components and Component Reliability, Corrosion, Lead-free Issues for Harsh Environments, Substrates and Finishes for Harsh Environments, Thermal Management, and Tin Whiskers.
PCB Technology: Black Pad and Surface Finish Defects, Creep Corrosion, Embedded Passive and Active Components, Halogen Free, HDI, Microvias (including filled and unfilled), Moisture Sensitivity, Soldermask, Substrate Reliability, Substrate Solderability, and Surface Finish.
Inclusion in the Technology Conference requires strictly technical papers (complimentary presentation slot for speakers) subject to final acceptance by the Technical Advisory Committee of SMTA China. All papers including abstract and biography for inclusion in the Conference Proceedings requested in both Chinese and English. All papers (powerpoint) suggest to be written and must presented in Chinese (translator provided by your company)
If you or your company wishes to share pertinent information with the highly qualified audience of SMTA China please submit your abstract to Peggy Chen by email to peggy@smta.org. Please include your name, job title, company affiliation, and all pertinent contact information as well as your choice of Technology Conference to present your paper.
Submit an abstract
Deadlines for bilingual Abstract and bilingual Speaker Bio submission:
SMTA China West Conference in Chengdu: 1 February 2012
SMTA China East Conference in Shanghai: 10 February 2012
SMTA China North Conference in Wuhan: 31 May 2012
SMTA China South Conference in Shenzhen: 10 June 2012
To show our appreciation for the high level of information sharing by the speakers, SMTA China would like to honor the best paper, and the speaker of best presentation, which award will be presented during the above SMTA events.
Thank you for your support of SMTA China and we look forward to hearing from you soon.
Best regards,
Michael YF Wong, Technical Advisory Committee Chairman of SMTA China, Tel:+86-760-8886-5795, Fax:+86-760-8886-5512, Email:Michael-yf.wong@emerson.com
For more information about SMTA China, our activities and programs, please contact:
SMTA China President
Executive Administrator