Introduction:
Adhesives, polymers, and soldering materials play an important role in manufacturing electronic devices. When looking at a technical data sheet for these materials it is important to understand how the properties defined on these data sheets affect the performance and reliability of the final end product. Furthermore, understanding how these properties are measured and what can and should be compared between data sheets. We will also look at how the process conditions play a role in these properties. We will discuss properties such as glass transition temperature (Tg), coefficient of thermal expansion (CTE), modulus, decomposition temperature (Td) and other material terms often used in technical data sheets. Attendees are encouraged to bring example technical data sheets and/or questions for discussion.

What you will learn:
After this training course attendees will have a better understanding of how these material properties affect reliability performance, the relationship between process and properties and understand what properties can be compared between data sheets. We will then apply what had been discussed to look at one specific type of adhesives used in surface mount technology - Methods and Selection of Circuit Board Protection. We will discuss the differences between potting, conformal coating, and other methods of protecting printed circuit boards and the advantages and disadvantages of each approach.

About the Instructor:
Brian J. Toleno, Ph.D. is the Director of Technical Service and Application Engineering for Henkel in Irvine, California. Brian obtained a Ph.D. in analytical chemistry from Penn State University, and his B.S. in chemistry from Ursinus College. Brian is an active member of IPC serving as the underfill handbook committee (J-STD-030) chairperson and vice-chair of the Solder Paste Standards Committee (J-STD-005). Brian is also a frequent speaker and contributor to SMTA, and was elected to the SMTA Board of Directors in 2010. Brian has written courses on underfill materials, Pb-free soldering, and failure analysis. He has also authored many publications for trade journals and peer reviewed publications on various aspects of materials in electronics, and two chapters for electronic engineering handbooks on adhesives and materials.

Contact Karen Frericks at 952-920-7682 with questions.