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Online Presentations: Webinars and Webtorials
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Listen to outstanding speakers without leaving your desk. SMTA Online Presentations are a great solution for getting the latest knowledge at the best price. There are currently two formats of online presentations: webinars and webtorials.
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Webinars:
One session lasting 60 to 90 minutes.
Covers introductory concepts or broadly covers multiple topics.
Comparable to a conference session.
Cost: $75USD for SMTA members/$150USD for non-members.*
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Webtorials:
Two sessions lasting 90 minutes each.
In depth, focused topics with demos and working examples.
Comparable to a tutorial.
Cost: $200USD for SMTA members/$300USD for non-members.*
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*The price of an individual membership is included in non-member registration.
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Upcoming Webinars and Webtorials
Each registrant is allowed one phone line connection for as many site employees as can be accommodated by your AV facilities. Multiple connections must be individually registered.
If you have any questions, contact Ryan Flaherty, Director of Communications at the SMTA. Ryan@smta.org 952-920-7682.
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Webinar:
PCB Depaneling with Lasers: A Comparison of Laser to Traditional Depaneling Methods
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 Thursday, February 9, 2012
11am - 12:30pm Eastern
Josh Brown, LPKF Laser & Electronics
Overview:
Depaneling of modern circuit boards can be a difficult task. Smaller, more complex PCBs are creating a demand for more sophisticated depaneling solutions. This webinar will walk you through the advantages and disadvantages of laser depaneling in comparison to more traditional methods of depaneling such as routing, die cutting and dicing saws. By the end of the webinar you will have a better understanding of laser depaneling and if it is a viable solution for your needs.
What you will learn:
A full comparison of depaneling methods Smaller boards, less stress and more precision Cost reduction: an unveiling of the costs involved in all methods Versatility: is your depaneling technology giving you an edge?
Who should attend:
PCB Engineers/Designers Manufacturing and Production Engineers Production Managers
Presenter bio:
Josh Brown is a Marketing Development Representative with LPKF Laser & Electronics, a manufacturer of laser depaneling systems. Josh's objective is to provide educational content to engineers and managers to help them make informed decisions on some of the latest PCB production technologies.
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Registrations are being taken through the SMTA Online Registration System.
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SMTA Webtorial
Tin Whiskers - A 2012 State of the Industry Assessment
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Two (2) 90 minute Sessions
Tuesday, February 14 and 21, 2012
1:00pm to 2:30pm Eastern
Presented by: Dave Hillman, Rockwell Collins Inc.
What You Will Learn:
Tin Whiskers were investigated and "solved" in the 1950s so why are we talking about them in 2012? The objective of this tin whisker course is to : (1) Provide a basic understanding of a tin whisker phenomena; (2) Provide data and resources allowing an attendee to create a tin whisker mitigation protocol applicable for their product/use environment; (3) Provide an update of some of the latest industry investigations and results.
Topics Covered:
Tin Whiskers 101 Tin Whisker Mitigations that You Don't Control Tin Whisker Mitigations that You Do Control Tin Whisker Mitigation Plan Basic Tenets Current Industry Tin Whisker Investigations
Instructor Bio:
David Hillman is a Metallurgical Engineer in the Advanced Operations Engineering Department of Rockwell Collins Inc. in Cedar Rapids, Iowa. Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering. In his present assignment he serves as an "expert of call" to manufacturing on material and processing problems. He served as a Subject Matter Expert (SME) for the Lead-free Manhattan Project in 2009. He has published numerous technical papers with the 2010 SMTA International Conference on lead-free thermal cycle test results presentation being selected as “Best of Conference”.
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Registrations are being taken through the SMTA Online Registration System.
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Webinar:
RoHS Product Eco-compliance - with all the changes, where do we stand now?
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 Tuesday, March 6, 2012
11am - 12:30pm Eastern
Presenter: Krista Crotty, Alberi EcoTech
Overview:
RoHS Recast and REACH updates and Conflict Minerals, Oh My! The RoHS Recast has been published, new SVHCs are being added to REACH every six months, and now the US is regulating conflict minerals used by public companies. Bring your questions about the use of the CE mark to mandatory declaration of conformity to open scope in RoHS, to which newest SVHC are used in electronics, to the latest from the SEC on the guidance ruling on conflict minerals. The session will also discuss enforcement practices, industry compliance best practices and lessons learned for general product eco-compliance.
What you will learn:
The latest information on the RoHS Recast, REACH SVHCs, and Conflict Minerals.
Who should attend:
Engineers, Compliance engineering, project managers... anyone dealing with materials information gathering – from component engineering to executive – can benefit from this update.
Bio: Krista Crotty, Chief EcoGeek
Krista Crotty holds a BS in Mechanical Engineering and a MS in Production and Operations Management. As Chief EcoGeek and managing partner of Alberi EcoTech, she helps clients face tough issues involving environmental compliance with determination and brutal honesty. As the author of several white papers and workshops on the subject of RoHS, REACH, and other key environmental initiatives, Krista has established her revolutionary perspective as the gold standard for businesses seeking assistance with product environmental compliance.
Before breaking out of the corporate world and founding her own companies, Krista spent several years with working for IBM in multiple divisions: Storage Systems (hard disk drives), Microelectronics (ceramic substrate manufacturing), and Corporate Procurement (electronic components). In Corporate Procurement at IBM from 2003-2005, Krista specifically focused on IBM’s compliance program for EU RoHS.
In addition to running Alberi, Krista co-chairs IPC's 2-18 Supplier Declaration committee, which is responsible for the 175x series of standards. The 175x series is most known for the 1752 Materials Declaration Standard. Prior to relocating to Las Vegas, Krista was instrumental in forming the Sustainability Forum sub-committee for the North Shore Technical Council (NSTC). She has also served as the SMTA Boston Chapter web master of the Surface Mount Technology Association (SMTA).
Outside the office, Krista relaxes by participating in the Sin City Mini Club, riding motorcycles, traveling with her husband, and racing a Swift DB-1 Formula Ford 1600.
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Registrations are being taken through the SMTA Online Registration System.
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SMTA Webtorial
Advanced Component Packages and Processes
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Two (2) 90 Minute Sessions
Tuesday, March 13 and 20, 2012
1:00pm to 2:30pm Eastern
Presented by: S. Manian Ramkumar Ph.D., Rochester Institute of Technology
Overview:
This course will introduce SMT users to the terminology, classifications, construction and assembly process for advanced component packages. Discover the advantages and disadvantages of each component type as well as their implementation requirements. High density interconnection, thermal management requirements and microvia technology will be discussed, and the details of the assembly process when using these devices, in both lead-based and lead-free assembly will be covered.
What Will You Learn:
Electronics packaging and levels Thermal management in advanced packaging Substrate properties for advanced packaging IC packaging trends, packaging evolution Area array packaging - BGA, CSP, WL-CSP and flip chip Self-centering of area array packages Assembly process for area array packages Rework and repair of area array packages Need for underfill and encapsulation Ceramic column grid array (CCGA) Chip-on-board (COB) technology Tape automated bonding (TAB) Multi-chip-module (MCM) PoP and 3D packaging, MEMS, etc.
Bio:
Dr. Ramkumar is a Professor at the Rochester Institute of Technology (RIT) and is the Director for the Center for Electronics Manufacturing & Assembly (CEMA). He teaches courses in surface mount electronics packaging and manufacturing automation. He was instrumental in developing the Center and the Automation laboratories at RIT. The electronics packaging Center is equipped with assembly and failure analysis equipment, to support hands-on training and applied research projects for industry. Dr. Ramkumar has been the principal investigator for several applied research projects. He has presented technical papers at the SMTA, APEX, IMAPS, ASME and IEEE conferences. He also teaches Surface Mount Technology (SMT) and Advanced Packaging courses at the IPC-APEX and SMTA shows and for various companies on-site.
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Registrations are being taken through the SMTA Online Registration System.
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SMTA Webtorial
Solder Pad Cratering
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Two (2) 90 minute Sessions
Thursday, April 12 and 19, 2012
1:00pm to 2:30pm Eastern
Presented by: Cheryl Tulkoff, DfR Solutions
What You Will Learn:
Pad cratering is defined as cracking which initiates within the laminate during a dynamic mechanical event such as In Circuit Testing (ICT), board depanelization, connector insertion, and other shock and vibration inducing activities. During this webtorial, you'll learn the key drivers, measurement and detection protocols, and preventive tactics for this serious but prevalent failure. Pad cratering was first recognized in BGA packages but newer leadless, bottom termination components are also vulnerable.
Topics Covered:
Pad Cratering Defined Is Pad Cratering a Pb-free issue? At risk components Drivers Finer pitch components More brittle laminates Stiffer solders (SAC vs. SnPb) Presence of a large heat sink Detection and Failure Analysis Procedures: Which ones are effective & why X-ray Dye-n-pry Ball shear Ball pull Mitigation Practices & Solutions to Pad Cratering Board Redesign Solder mask defined vs. non-solder mask defined Limitations on board flexure 750 to 500 microstrain, Component dependent Specification and Procedure Discussion Strain Gage Testing Protocols ICT Fixture Evaluation Assembly Process Evaluation Process Specifications More compliant solder SAC305 is relatively rigid, SAC105 and SNC are possible alternatives New acceptance criteria for laminate materials Intel-led industry effort Attempting to characterize laminate material using high-speed ball pull and shear testing, Results inconclusive to-date Alternative approaches Require reporting of fracture toughness and elastic modulus
Targeted Audience:
Design, Manufacturing, and Failure Analysis Engineering
Instructor Bio:
Cheryl Tulkoff is an industry renowned expert in the fields of semiconductor fabrication, electronics assembly, RoHS conversion, and reliability engineering and management. Prior to joining DfR, Ms. Tulkoff had an active leadership role both within her employer's companies and among regional and national electronics and reliability organizations. At her most recent position at National Instruments, Cheryl developed a comprehensive reliability organization, including the creation of an internal failure analysis group and a closed loop reliability program. She has also taken the lead in process development and implementation in semiconductor fabrication through her work at Cypress Semiconductor in electronics assembly, and through her work at IBM. Cheryl is the head of DfR's office located in Austin, Texas, which opened in February 2009. B.S., Mechanical Engineering (Georgia Institute of Technology)
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Registrations are being taken through the SMTA Online Registration System.
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SMTA Webtorial
Cleaning Agent and Cleaning Equipment Innovations Needed to Clean Highly Dense Assemblies
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Two (2) 90 Minute Sessions
Tuesday, May 22 and 26, 2012
1:00pm to 2:30pm Eastern
Presented by: Mike Bixenman, Kyzen Corporation
Overview:
As highly dense circuit assemblies continue to advance at a rapid pace, the removal of process residues is ever more necessary. Low residue no-clean residues did not require cleaning on assemblies with larger spacing between conductors. As the distance between conductors narrow, residues under component gaps pose a reliability risk. Additionally, the transition to lead-free alloys with tighter component densities requires flux residue innovations that can withstand higher reflow temperatures. Traditional cleaning agents and cleaning equipment may not be able to remove these harder to clean flux residues from extremely small geometries.
Increased circuit functionality is accomplished using bottom termination surface mount components. As components reduce in size, the distance from the board to the underside of the component reduces. Flux residues bridge conductors making cleaning highly difficult. One of the most challenging issues is the selection of an appropriate cleaning process that will clean flux residues under these extremely tight geometries.
Cleaning agents must be designed to remove strong covalent (hydrophobic) and weak ion (hydrophilic) bonds. Cleaning machines must be designed to move the cleaning agent to the source of the residue and either extract or create a flow channel to remove residues under component gaps. Recent solvent and aqueous cleaning agent and cleaning equipment innovations have been developed to bridge this gap.To achieve the process objective, cleaning agent and cleaning equipment suppliers collaborate with assemblers to develop improved cleaning processes.
Topics Covered:
Chemical Properties of Residues Solvent and Aqueous Cleaning Agents Innovations Designed to Remove Residues Cleaning Equipment Innovations Designed to Remove Flux Residues under Bottom Termination Components Integrating Cleaning Agent and Cleaning Machine Controlling the Process
Who Should Attend:
Circuit Assembly Designers Process Engineers Quality Control Engineers Environmental Engineers
Instructor Bio:
Mike is one of the joint founders and CTO of Kyzen Corporation. He is an active researcher and innovator in the precision cleaning field. Mike chaired the IPC Cleaning & Alternatives Handbook, IPC Stencil Cleaning Handbook, and two IPC/SMTA Cleaning and Conformal Coating Conferences. Mike has published over 100 tech papers and received a number of awards in his field of expertise. Mike holds four earned degrees, including a Doctorate of Business Administration from the University Of Phoenix School Of Advanced Studies.
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Registrations are being taken through the SMTA Online Registration System.
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SMTA Webtorial
PWB Reliability Failure Modes
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Two (2) 90 Minute Sessions
Tuesday, June 19 and 26, 2012
1:00pm to 2:30pm Eastern
Presented by: Paul Reid PWB Interconnect Solutions Inc.
Overview:
The three hour Webtorial will cover the concept of reliability and the effect of lead free assembly on printed wire boards (PWBs). The class will focus on PWB failure modes that are induced by thermal excursions associated with accelerated testing, assembly and rework to include PTH (barrel), interconnect, buried via and microvias failures for a total of 10 failure modes. The Webtorial will include failure modes associated with complex interconnect structures including stagger and stacked microvias and microvias on buried vias which embrace and additional five failure modes unique to these HDI structures. Animations, illustrations and micrographs of specific failure modes will be reviewed. The class will include a quick overview of material failures that have become more common with lead free assembly and rework. The role of surface finishes on circuit board reliability, specifically hot air leveling and finishes which incorporate Nickel will be reviewed.
Who Should Attend:
The attendee will learn the limits and advantages of quality requirements and reliability testing. How to use reliability testing as a tool for PWB procurement, a method to rank variables like fabrication and assembly process, design, materials and PWB fabricators, an acceleration test to establish object field life predictions. The attendee will learn to review microsections from the point of view of understanding influences on reliability, the effects of surface finishes and the challenge of the Restriction of Hazardous Substances (RoHS) on PWB reliability.
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Registrations are being taken through the SMTA Online Registration System.
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SMTA Webtorial
Failure Analysis: Lessons Learned in Manufacturing
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Two (2) 90 Minute Sessions
Thursday, July 19 and 26, 2012
1:00pm to 2:30pm Eastern
Presented by: Martin Anselm PWB Interconnect Solutions Inc.
Overview:
Universal Instruments Corp’s Advanced Process Laboratory has observed countless failures in electronics manufacturing. From fine pitch printing, to PoP, 01005 defects, and high Tg laminate failures. These failures combined with internal research have provided a unique perspective for design for manufacturability and reliability. These lessons will be presented to the class when we discuss material selection, current electronics research, and failure analysis case studies. We will touch on design considerations for many advanced assembly processes as well as discussing types of analytical techniques that can be used for materials characterization.
Topics Covered:
What are the major difficulties in lead-free reliability testing Mixed alloy assembly best practices PCB plating considerations Analytical testing techniques and what they can identify root causes for production failures. Lead-free laminate selection and testing procedures: Can your board withstand 9x reflow? Learned lessons from actual failure analysis case studies
Suggestion:
Please bring specific questions or examples of surface mount process difficulties you are willing to share for an open discussion at the end of class. In my experience many problems can be solved with a brief discussion of the issues.
Instructor Bio:
Since 2002 Martin has been working in electronics Failure Analysis and currently oversees all the failure analysis projects for the Universal Instruments Corporation's Advanced Process Lab (APL). Martin’s surface mount assembly process knowledge and formal education in Mechanical Engineering, Materials Science, and Physics has given him a unique background for the determination of root cause in electronics. Martin has worked with some of the world’s largest electronics manufacturers not only determining root cause, but to also implementing process, design, parts, and materials changes in order to improve end product quality, reliability, and manufacturability.
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Registrations are being taken through the SMTA Online Registration System.
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SMTA Webtorial
Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World
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Two (2) 90 Minute Sessions
Thursday, September 6 and 13, 2012
3:00pm to 4:30pm Eastern
Presented by: Ray Prasad, Ray Prasad Consultancy Group
Overview:
Bottom Termination surface mount Components (BTCs) go by various names such as QFN, DFN, SON, LGA, MLP, and MLF, which utilize surface to surface interconnections. BTCs are like BGAs which also have hidden terminations, but they are also very different. BTCs do not have spheres but rather metallized terminations or pads underneath the package. This minor difference in the physical I/O shape makes all the difference in design, assembly and rework between BTCs and BGAs.
Since there are no leads or balls in BTCs to take up any slack from package or board warpage, you essentially need perfection in design and assembly process. When was the last time you saw every thing perfect on any manufacturing floor?
One must also keep in mind that these parts are not the only components that must be mounted on the board. Look at any board. It will have other packages such as BGAs, fine pitch and even some through-hole components; and those components have their own unique design and assembly implementation requirements. So designing for BTCs may involve trial and error and lot of frustration by many companies. Additional frustration is caused by fast-paced changes in packaging technologies and the advent of Lead Free has compounded the designer’s task.
When it comes to inspection, BTCs pose even more challenge than BGAs. What you may see in visual inspection may look bad but may really be acceptable. And what you don’t or can’t see may really be critical. And the fact that the Process Engineer must worry about both too much solder and too little solder on the same BTC package makes the quality engineer nervous about field returns.
What You Will Learn:
Sept 6th Introduction Pros and Cons of BTC Pull Back Vs Non Pull Back BTC Package Manufacturing Process Major Design Considerations for BTCs Laminates and Surface Finish Considerations Land Pattern and Stencil Design Guidelines Component considerations
Sept 13th Assembly Process Guidelines for BTC Solder Paste Printing- the Key Process Step Reflow Process Guidelines BTC Solder Joint Quality Requirements BTC Rework Process Key strategies in design and manufacturing processes to prevent field returns
Who Will Benefit:
The target audiences for this course are managers, design, process and quality engineers, and operators and technicians who deal with the electronic design, assembly, inspection, and repair processes. The intent is to provide useful and practical information to those are using or considering tin/lead or lead-free processes for assembly of BTCs. Anyone in process, quality, manufacturing, design, purchasing and management who wants to get a good understanding of design and manufacturing issues in BTCs for building assemblies in-house or at a subcontractor will benefit from this course.
About The Instructor:
Ray Prasad is the founder of Ray Prasad Consultancy Group. Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BTC, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.
Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley, USA. He is a registered Professional Metallurgical Engineer.
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Registrations are being taken through the SMTA Online Registration System.
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MORE WEBINARS COMING SOON!
Non-members, if you register at the same time for more than one event, you will be charged the non-member rate just once. Price adjustment is done upon receipt of your order information.
After registration, instructions for dialing in and for further technology requirements will be sent to attendees by email within 48 hours of the scheduled event.
Each registrant is allowed one connection for as many site employees as can be accommodated by its AV facilities.
All cancellation requests must be received prior to the start time of the event.
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The information presented during the SMTA events described above is offered for information purposes only and is not intended as a recommendation. Use of any portion of the content of this presentation is done at the discretion of you and your company. The presenter and the association are not responsible for any results obtained by implementing, employing, or in any way utilizing or interpreting the information presented.
Furthermore, all presentation materials are protected by applicable copyright laws. Any unauthorized use, duplication or distribution outside of the context of the presentation is strictly prohibited.
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CONSIDERATIONS FOR RECEIVING THE BROADCAST
Register via GoToWebinar upon recieving the email with confirmation and instructions.
As attendee audio lines are muted for the duration of the presentation, prepare questions in advance and use GoToWebinar chat functionality to submit as they arise (or discard as they are answered).
For all technical/customer service issues during the presentation, contact GoToWebinar customer service at (800) 263-6317 (US and Canada, toll free), or +1 (805) 690-5753 (direct dial)
or email gotowebinar@citrixonline.com.
Beyond the time frame of on-line presentations, use the SMTA Q&A Forum for continuing discussions among attendees regarding the presentation.
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